IC Packaging Engineer
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- CambridgeCB
- Posted 11th Mar 2010
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Posted by:
Enterprise Recruitment Limited
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Salary:
50000 GBP per annum
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Job Type:
Permanent
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Reference:
2244476
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This job has been viewed
273 times
since it was posted.
Job Description
IC Packaging Engineer
This is a fantastic opportunity to join a rapidly expanding world leader in wireless audio. Their aim is a world, free of the awkward tangle of wires that is now needed to connect headsets and speakers to mobile phones, MP3 players, PC\'s and Hi-Fi systems.
You will be working closely with ASIC design teams to co-design packages in parallel with silicon designs to achieve the best product in terms of performance, reliability, cost and suitability for application. The role encompasses the design of WLCSP, BGA, LGA, SiP and Multi-Chip packages, to complement leading IC designs with exposure to RF, analogue, digital and Embedded NVM technology in a single CMOS integrated circuit. You\'ll be expected to produce optimised package designs and be responsible for ensuring the manufacturability of products and the smooth transfer of the product from Development to Product Engineering.
Interested? Please get in touch with Andrew Langridge at Enterprise Recruitment for further details?
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